Display device

ABSTRACT

The present disclosure relates to a display device including: a flexible substrate including an active area and a bezel area disposed outside the active area, the active area including a module area in which multiple holes are provided; a back plate disposed on one surface of the flexible substrate, and being provided with an opening disposed in a manner that corresponds to the module area; a thin-film transistor and wire formation layer disposed on another surface of the flexible substrate, and including multiple light-transmitting areas disposed in a manner that corresponds to the opening; and a module received within the opening of the back plate, wherein the module receives light from outside through the multiple light-transmitting areas, the multiple holes, and the opening.

CROSS REFERENCE TO RELATED APPLICATION

The present application is a continuation of U.S. patent applicationSer. No. 17/109,818 filed on Dec. 2, 2020, which claims priority toRepublic of Korea Patent Application No. 10-2019-0163662, filed Dec. 10,2019, each of which is incorporated by reference in its entirety.

BACKGROUND Field of Technology

The present disclosure relates to a display device.

Description of the Related Art

As information society has developed, demands for a display devicedisplaying an image have increased in various forms. For example, aflat-panel display (FPD), which is thin and light and may be implementedin a large size, has been rapidly developed, replacing a cathode-raytube (CRT), which is bulky. As such a flat-panel display, a variety offlat-panel displays, such as a liquid crystal display (LCD), a plasmadisplay panel (PDP), an electroluminescent (EL) display, afield-emission display (FED), and an electrophoretic display (EPD), hasbeen developed and utilized.

Such display devices include a display panel, a driver, a power supply,and the like. The display panel includes display elements for displayinginformation, the driver drives the display panel, and the power supplygenerates power to be supplied to the display panel and the driver.

In addition, in such display devices, various elements, such as acamera, a sensor, and the like, for implementing a multimedia functionare introduced in the form of a module. In general, these elements aredisposed outside a display area.

However, the disposition of the camera, and the like, outside thedisplay area has a problem of increasing the bezel part.

The foregoing is intended merely to aid in the understanding of thebackground of the present disclosure, and is not intended to mean thatthe present disclosure falls within the purview of the related art thatis already known to those skilled in the art.

SUMMARY

The present disclosure provides a display device that is capable ofbeing provided with a module, such as a camera, and the like, without anincrease in the size of a bezel part of the display device, and enablingthe module not to be visible.

According to a first feature of the present disclosure, there isprovided a display device including: a flexible substrate including anactive area and a bezel area disposed outside the active area, theactive area including a module area in which multiple holes areprovided; a back plate disposed on one surface of the flexiblesubstrate, and being provided with an opening disposed in a manner thatcorresponds to the module area; a thin-film transistor and wireformation layer disposed on another surface of the flexible substrate,and including multiple light-transmitting areas disposed in a mannerthat corresponds to the opening; and a module received within theopening of the back plate, wherein the module receives light fromoutside through the multiple light-transmitting areas, the multipleholes, and the opening.

According to a second feature of the present disclosure, there isprovided a display device including: a back plate including an activearea and a bezel area disposed outside the active area, the active areaincluding a module area in which an opening is provided; a firstflexible substrate, an insulation layer, and a second flexible substratesequentially stacked on one surface of the back plate; a thin-filmtransistor and wire formation layer disposed on one surface of thesecond flexible substrate, and including multiple light-transmittingareas disposed in a manner that corresponds to the opening; and a modulereceived within the opening of the back plate, wherein at least oneamong the first flexible substrate and the second flexible substrate isprovided with multiple holes that correspond to the multiplelight-transmitting areas, respectively, and the module receives lightfrom outside through the multiple light-transmitting areas, the multipleholes, and the opening.

According to the display device of the present disclosure, since themodule, such as a camera, a sensor, and the like, is disposed to bereceived in the opening of the back plate positioned in the displayarea, an increase in the size of the bezel part is prevented.

In addition, the module is received in the opening of the back plate andis thus not exposed to outside.

In addition, the multiple holes are formed in the flexible substrate insuch a manner as to correspond to the opening of the back plate, and themultiple light-transmitting areas are formed in the thin-film transistorand wire formation layer, and the opening, the multiple holes, and themultiple light-transmitting area are disposed to overlap each other, sothat the change in color of light entering the module received in theopening of the back plate is reduced and thus sensitivity to lightentering the module is increased.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objectives, features, and other advantages of thepresent disclosure will be more clearly understood from the followingdetailed description when taken in conjunction with the accompanyingdrawings, in which:

FIG. 1 is a plan view schematically showing a display device accordingto an embodiment of the present disclosure;

FIG. 2 is a plan view showing a portion of the display panel shown inFIG. 1 in more detail according to an embodiment of the presentdisclosure;

FIG. 3 is a plan view showing a module area shown in FIG. 2 according toan embodiment of the present disclosure;

FIG. 4 is a cross-sectional view taken along line I-I′ shown in FIG. 3according to an embodiment of the present disclosure;

FIGS. 5A to 5C are cross-sectional views showing a first embodiment of asubstrate and a buffer layer of a display device shown in FIG. 4 ;

FIGS. 6A to 6D are cross-sectional views showing a second embodiment ofa substrate and a buffer layer of a display device shown in FIG. 4 ;

FIGS. 7A to 7D are cross-sectional views showing a third embodiment of asubstrate and a buffer layer of a display device shown in FIG. 4 ;

FIGS. 8A to 8C are cross-sectional views showing a fourth embodiment ofa substrate and a buffer layer of a display device shown in FIG. 4 ;

FIG. 9 is a chromaticity diagram showing changes in color characteristicin cases where a flexible substrate of a display device according to thepresent disclosure is provided with holes, and in a case, as acomparative example for comparison, where the flexible substrate is notprovided with holes; and

FIG. 10 is a graph and a table showing changes in color coordinates inembodiments 1 and 2 of the present disclosure and the comparativeexample shown in FIG. 9 .

DETAILED DESCRIPTION

Advantages and features of the present disclosure, and methods toachieve these will be apparent from the following embodiments that willbe described in detail with reference to the accompanying drawings. Itshould be understood that the present disclosure is not limited to thefollowing embodiments and may be embodied in different ways, and thatthe embodiments are given to provide complete the present disclosure andto provide a thorough understanding of the present disclosure to thoseskilled in the art. The scope of the present disclosure is defined onlyby the claims.

The shapes, sizes, ratios, angles, numbers, and the like illustrated inthe accompanying drawings for describing embodiments of the presentdisclosure are merely examples, and the present disclosure is notlimited thereto. Throughout the description, the same reference numeralsrefer to same elements. In addition, in describing the presentdisclosure, if it is decided that the detailed description of the knownart related to the present disclosure makes the subject matter of thepresent disclosure unclear, the detailed description will be omitted.

The terms such as “including”, “having”, and “comprising” used hereinare generally intended to allow other components to be added unless theterms are used with the term “only”. The terms of a singular form mayinclude plural forms unless specifically stated otherwise.

In construing an element, the element is construed as including an errorrange although there is no explicit description.

In describing a position relationship, for example, when the positionrelationship between two parts is described using the terms such as“on”, “above”, “below”, “next”, and the like, one or more other partsmay be positioned between the two parts unless the term “immediately” or“directly” is used.

In describing a time relationship, for example, when the temporal orderrelationship is described using the terms such as “after”, “subsequentto”, “next”, “before”, and the like, a case which is not continuous maybe included unless the term “immediately” or “directly” is used.

It is noted that the terms “first”, “second”, etc. may be used todescribe various elements, but these elements are not limited by theseterms. These terms are only used to distinguish one element from anotherelement. Accordingly, a first element described below could be termed asecond element without departing from the technical idea of the presentdisclosure.

An “X-axis direction”, a “Y-axis direction”, and a “Z-axis direction”should not be construed as only a geometric relationship where arelationship therebetween is vertical, and may denote having a broaderdirectionality within a scope where elements of the present disclosureoperate functionally.

The phrase “at least one” should be understood as including anycombination possible from one or more related items. For example, themeaning of “at least one among a first item, a second item, and a thirditem” denotes the first item, the second item, or the third item as wellas any combination of two or more items selected from a group of thefirst item, the second item, and the third item.

Features of various embodiments of the present disclosure can bepartially or overall coupled to or combined with each other, and canvariously inter-operate with each other and be driven technically. Theembodiments of the present disclosure can be performed independentlyfrom each other, or can be performed together in co-dependentrelationship.

Hereinafter, a display device according to an embodiment of the presentdisclosure will be described with reference to FIGS. 1 to 4 .

FIG. 1 is a plan view schematically showing a display device accordingto an embodiment of the present disclosure. FIG. 2 is a plan viewschematically showing a portion of the display panel shown in FIG. 1 ,and is the plan view including an enlarged view of a module area.

Referring to FIGS. 1 and 2 , a display device according to an embodimentof the present disclosure may include a display panel 10, a data driver,a gate driver, a power supply PS, a timing controller TC, and the like.

The display panel 10 includes an active area AA on which information isdisplayed, and a bezel area BA on which information is not displayed.

The active area AA is an area on which an input image is displayed, andan area in which a pixel array of multiple pixels P arranged in a matrixtype is disposed.

The bezel area BA is an area in which shift registers SRa and SRb of agate driving circuit, various link signal wires (for example, DL1 toDLn), link power supply lines VDL1, VDL2, VSL1, and VSL2, power supplyelectrodes VDLa and VDLb, and the like are disposed. The pixel arraydisposed in the active area AA includes multiple data lines D1 to Dm andmultiple gate lines G1 to Gn, which are disposed to intersect with eachother, and pixels P disposed at all the intersection regions in a matrixform.

Each of the pixels P includes a light-emitting diode (LED), a drivingthin-film transistor (hereinafter, referred to as a driving TFT (DT))controlling the amount of current flowing to the light-emitting diode(LED), and a programming part (SC) for setting a voltage between a gateand a source of the driving TFT (DT). From the power supply PS, thepixels P of the pixel array receive first power Vdd, which is ahigh-potential voltage, through first-power lines VD1 to VDm, andreceive second power Vss, which is a low-potential voltage, throughsecond-power lines VSL1 to VSL2.

The first-power lines VD1 to VDm receive the first power Vdd from thepower supply PS through the lower first-power supply electrode VDLa andthe upper first-power supply electrode VDLb on opposite sides. The lowerfirst-power supply electrode VDLa is disposed in the bezel area BA onthe side where a chip-on film 30 is attached, and the upper first-powersupply electrode VDLb is disposed in the opposite bezel area. Theopposite end portions of the lower first-power supply electrode VDLa andthe upper first-power supply electrode VDLb are connected with eachother via the link wires VDL1 and VDL2. Accordingly, it is possible tominimize deterioration in display quality caused by an increase inresistance capacitance (RC) depending on the positions of pixelsdisposed in the active area AA.

The programming part SC may include at least one switch TFT, and atleast one storage capacitor. The switch TFT is turned on in response toa scan signal from a gate line GL, and thus applies a data voltage fromthe data lines D1 to Dm to an electrode on one side of the storagecapacitor. The driving TFT (DT) controls the amount of current suppliedto the light-emitting diode (OLED) according to the magnitude of thevoltage with which the storage capacitor is charged, and thus adjuststhe amount of light emitted from the light-emitting diode (OLED). Theamount of light emitted from the light-emitting diode (OLED) isproportional to the amount of current supplied from the driving 1H (DT).

The TFTs constituting a pixel may be implemented in p type or n type. Inaddition, a semiconductor layer of the TFTs constituting a pixel mayinclude amorphous silicon, polysilicon, or oxide. The light-emittingdiode (LED) includes an anode electrode, a cathode electrode, and alight-emitting structure interposed between the anode electrode and thecathode electrode. The anode electrode is connected to the driving TFT(DT). The light-emitting structure includes an emission layer (EML).With the emission layer interposed, on one side thereof, a holeinjection layer (HIL) and a hole transport layer (HTL) are disposed, andon the opposite side, an electron transport layer (ETL) and an electroninjection layer (EIL) are disposed.

The data driver is equipped with a data IC (SD). One side is connectedto one end portion of a source printed circuit board 20, and anotherside includes the chip-on film 30 attached on the bezel area BA of thedisplay panel 10.

The data IC (SD) generates a data voltage by converting digital videodata input from the timing controller TC, to an analog gammacompensation voltage. The data voltage output from the data IC (SD) issupplied to the data lines D1 to Dm through the data links DL1 to DLn.

For the gate driver, a type in which a chip-on film equipped with a gateIC is disposed on one side of the display panel, or a GIP type in whicha gate IC is formed on the display panel may be used. In the presentdisclosure, a GIP-type gate driver will be described as an example.

The GIP-type gate drivers includes level shifters LSa and LSb, which aremounted on the source printed circuit board 20, and the shift registersSRa and SRb, which are provided on the bezel area BA of the displaypanel 10 and receive signals supplied from the level shifters LSa andLSb.

The level shifters LSa and LSb receive signals, such as a start pulseST, gate shift clocks GCLK, a flicker signal FLK, and the like, from thetiming controller TC, and also receive driving voltages, such as a gatehigh voltage VGH, a gate low voltage VGL, and the like. The start pulseST, the gate shift clocks GCLK, and the flicker signal FLK are signalsswinging between approximately 0 V and 3.3 V. The gate shift clocks GCLKare n-phase clock signals having a predetermined phase difference. Thegate high voltage VGH is a voltage that is equal to or greater than athreshold voltage of a thin-film transistor (TFT) provided in an arrayof thin-film transistors of the display panel 10, and is a voltage ofabout 28 V. The gate low voltage VGL is a voltage that is less than thethreshold voltage of the thin-film transistor (TFT) provided in thearray of thin-film transistors of the display panel 10, and is a voltageof about −5 V.

The level shifters LSa and LSb output shift clock signals CLK thatresult from level shift of the start pulse ST and each of the gate shiftclocks GCLK input from the timing controller TC by using the gate highvoltage VGH and the gate low voltage VGL. Therefore, each of a startpulse VST and the shift clock signals CLK output from the level shiftersLSa and LSb swing between the gate high voltage VGH and the gate lowvoltage VGL. The level shifters LSa and LSb may lower the gate highvoltage according to the flicker signal FLK and may thus lower akick-back voltage (ΔVp) of a liquid crystal cell, thereby reducingflicker.

Output signals of the level shifters LSa and LSb may be supplied to theshift registers SRa and SRb through wires formed on the chip-on film 30in which the source driver IC (SD) is disposed, and line-on-glass (LOG)wires formed on a substrate of the display panel 10. The shift registersSRa and SRb may be formed directly on the bezel area BA of the displaypanel 10 by a GIP process.

The shift registers SRa and SRb shift the start pulse VST input from thelevel shifters LSa and LSb according to the shift clock signals CLK1 toCLKn, and thus sequentially shifts a gate pulse swinging between thegate high voltage VGH and the gate low voltage VGL. The gate pulsesoutput from the shift registers SRa and SRb are supplied sequentially tothe gate lines G1 to Gn.

The timing controller TC receives, from a host system (not shown), atiming signal, such as a vertical synchronization signal, a horizontalsynchronization signal, a data enable signal, a main clock, and thelike, and synchronizes operation timing of the data IC (SD) and the gatedrivers. Data timing control signals for controlling the data IC (SD)may include a source sampling clock (SSC), a source output enable (SOE)signal, and the like. Gate timing control signals for controlling thegate drivers may include a gate start pulse (GSP), a gate shift clock(GSC), a gate output enable (GOE) signal, and the like.

Although FIG. 1 shows a configuration in which the shift registers SRaand SRb are disposed on opposite sides, respectively, outside the activearea AA and supply gate pulses to the gate lines G1 to Gn, at oppositeend portions of the active area AA, the present disclosure is notlimited to this. The shift register may be disposed on only one side ofthe active area AA and may supply the gate pulses to the gate lines G1to Gn, on the one side of the active area AA. When the shift registersSRa and SRb are disposed on the opposite sides, respectively, outsidethe active area AA, gate pulses having the same phase and the sameamplitude are supplied to the gate lines disposed on the same horizontalline of the pixel array.

Referring to FIG. 2 , the display panel 10 of the present disclosureincludes the active area AA and the bezel area BA outside the activearea AA.

The active area AA is an area in which a pixel array for displayinginformation, such as text, figures, pictures, photos, images, and thelike, is disposed. The active area AA may include at least one modulearea MA disposed in the active area AA. The module area MA may bedisposed anywhere in the active area AA.

The module area MA is an area in which a camera, a speaker, a sensor,and the like are disposed. The module area MA may include: at least onepixel P; a thin-film transistor provided to supply a signal to eachpixel P; a signal wire including a gate line (for example, G1) and adata line (for example, D1) that are connected to the thin-filmtransistor and disposed to intersect with each other; and alight-transmitting area (TA) disposed away from the lines.

The bezel area BA is an area surrounding the active area AA outside theactive area AA, and is an area in which the following is disposed: theshift registers SRa and SRb for generating gate pulses to be supplied tothe pixel array of the active area AA; signal wires for supplyingvarious types of signals; and power supply wires for supplying varioustypes of power.

Hereinafter, with reference to FIGS. 3 and 4 , the module area of thedisplay device according to an embodiment of the present disclosure willbe described in detail.

FIG. 3 is a plan view showing a module area of a display deviceaccording to an embodiment of the present disclosure. FIG. 4 is across-sectional view taken along line I-I′ of FIG. 3 .

Referring to FIGS. 3 and 4 , the module area MA includes multiple pixelsPr, Pg, and Pb, and multiple light-transmitting areas TA disposedbetween the adjacent pixels (Pr and Pg, Pg and Pb, or Pb and Pr), andthe non-module area NMA is outside the module area MA. In each of thelight-transmitting areas TA, a signal line or thin-film transistorconnected to each of the pixels Pr, Pg, and Pb is not disposed.

The module area MA includes: a back plate BP; a flexible substrate SUBdisposed on the back plate BP; a buffer layer BUF disposed on theflexible substrate SUB; a thin-film transistor and wire formation layerT/WL formed on the buffer layer; an light-emitting element layer ELdisposed on the thin-film transistor and wire formation layer T/WL; anencapsulation layer ENC disposed on the light-emitting element layer EL;and a polarizing film POL disposed on the encapsulation layer ENC.

The back plate BP is provided with an opening OP in which a module MO,such as a camera, and a sensor, is received. The opening OP in the backplate BP may be formed to completely expose the flexible substrate SUBpositioned on the top of the back plate BP. In the case where theflexible substrate SUB is too thin, the back plate BP is disposed on therear surface of the display device to keep the display device flat. Inaddition, the back plate BP reduces adhesion of foreign matter to theflexible substrate SUB, and cushions the impact applied from outside.The back plate BP may be made of a polymer material, such aspolyethylene terephthalate (PET), poly carbonate (PC), and polyethylenenaphthalate (PEN).

The flexible substrate SUB is provided with multiple holes Hs disposedseparately from each other. At least one or some of the multiple holes Hformed on the flexible substrate SUB is disposed to overlap the openingOP in the back plate BP. The flexible substrate SUB may be made of aflexible material, for example, polyimide (PI).

The buffer layer BUF may be a single layer composed of any one ofinorganic and organic materials so as to prevent a light-emittingelement from being damaged by impurities such as alkali ions, and thelike that flow out of the flexible substrate SUB. Alternatively, thebuffer layer BUF may be multiple layers formed of different inorganicmaterials, or multiple layers of an organic material layer and aninorganic material layer that are alternately disposed. Examples of theinorganic material layer may include any one among a silicon oxide film(SiOx), and a silicon nitride film (SiNx). Examples of the organicmaterial may include photoacrylic. However, the inorganic material andthe organic material are not limited to the above-described materials.

The thin-film transistor and wire formation layer T/WL includes:thin-film transistors and wires formed to supply signals to each pixel;and multiple light-transmitting areas TA disposed in the areas wherethese thin-film transistors and wires are not formed. The multiplelight-transmitting areas TA of the thin-film transistor and wireformation layer T/WL are disposed in a manner that the multiplelight-transmitting areas TAs respectively correspond to the multipleholes H in the flexible substrate SUB. That is, the multiplelight-transmitting areas TA and the multiple holes H are disposed in amanner that they overlap with each other. In the display device, thethin-film transistors and wires formed to supply signals are generalelements, and thus herein, a detailed description thereof will beomitted.

The light-emitting element layer EL may include the multiple pixels Pr,Pg, and Pb, and a bank BN that divides the multiple pixels Pr, Pg, andPb and has high light transmittance. The multiple pixels Pr, Pg, and Pbare disposed not to overlap the multiple light-transmitting areas TA ofthe thin-film transistor and wire formation layer T/WL and the multipleholes H in the flexible substrate SUB.

Each of the multiple pixels Pr, Pg, and Pb includes an anode electrode,a cathode electrode, and an organic emission layer interposed betweenthe anode electrode and the cathode electrode. The anode electrode (ANO)may be made of a transparent conductive material, such as indium tinoxide (ITO), indium zinc oxide (IZO), or zinc oxide (ZnO). The organicemission layer may include an emission layer (EML). With the emissionlayer interposed, a hole injection layer (HIL) and a hole transportlayer (HTL) may be disposed on one side, and an electron transport layer(ETL) and an electron injection layer (EIL) may be disposed on the otherside. The cathode electrode may be made of magnesium (Mg), calcium (Ca),aluminum (Al), silver (Ag), or an alloy thereof, which have a low workfunction.

The encapsulation layer ENC is a light-transmitting layer and may beformed in a multi-layer structure in which an inorganic material layerand an organic material layer are alternately disposed so as to minimizepenetration of moisture or oxygen from outside into the light-emittingelements positioned inward from the encapsulation layer ENC.

The polarizing film POL is a film for preventing deterioration incontrast caused by external light.

In the display device according to the above-described embodiment of thepresent disclosure, the module MO, such as a camera, a sensor, and thelike, is received in the opening OP in the back plate BP. Since theopening OP in the back plate BP is disposed to overlap at least one ofthe multiple holes H in the flexible substrate SUB and the multipleholes H in the flexible substrate SUB overlap the multiplelight-transmitting areas TA, light from outside reaches the module MOthrough the polarizing film POL, the encapsulation layer ENC, the bankBN of the light-emitting element layer EL, the multiple holes H in theflexible substrate SUB, and the opening OP in the back plate BP.Accordingly, since the module MO, such as a camera, a sensor, or thelike, is received in the opening OP in the back plate BP and ispositioned within the display area, it is possible to prevent the moduleMO, such as a camera, a sensor, and the like, from being visible fromoutside without deterioration in function.

Hereinafter, with reference to FIGS. 5A to 8C, the flexible substrateand the buffer layer of the display device according to embodiments ofthe present disclosure will be described in detail.

FIGS. 5A to 5C are cross-sectional views showing a first embodiment ofthe substrate and the buffer layer of the display device shown in FIG. 4. FIGS. 5A to 5C show embodiments of the cases where the flexiblesubstrate is formed of a single layer.

Referring to FIG. 5A, the flexible substrate SUB disposed on the backplate BP is provided with multiple holes H disposed separately from eachother. Each of the multiple holes H is formed as a concave portionhaving a depth less than the thickness of the flexible substrate SUB.The concave portion is open toward the back plate BP and is connected tothe opening OP in the back plate BP.

Referring to FIG. 5B, the flexible substrate SUB disposed on the backplate BP is provided with multiple holes H disposed separately from eachother. Each of the multiple holes H is formed as a concave portionhaving a depth less than the thickness of the flexible substrate SUB.The concave portion is open toward the buffer layer BUF and defines aspace made airtight by a lower surface of the buffer layer BUF.

Referring to FIG. 5C, the flexible substrate SUB disposed on the backplate BP is provided with multiple holes H disposed separately from eachother. Each of the multiple holes H is formed as a through holepenetrating through the flexible substrate SUB. The through hole is opentoward the back plate BP and is connected to the opening OP in the backplate BP.

In the first embodiment of FIGS. 5A to 5C, FIGS. 5A and 5B shows thecase where the holes H in the flexible substrate are formed as theconcave portions, and FIG. 5C shows the case where the holes H in theflexible substrate are formed as the through holes. According to theembodiment of FIGS. 5A and 5B, since a part of the flexible substrateremains in the region of the holes H, shift in color coordinates isreduced and reliability is increased, simultaneously. According to theembodiment of FIG. 5C, since the flexible substrate is not present inthe region of the holes H, optical properties (superior transmittance,reduction in color coordinate shift) are superior.

FIGS. 6A to 6D are cross-sectional views showing a second embodiment ofthe substrate and the buffer layer of the display device shown in FIG. 4. FIGS. 6A to 6D show embodiments of the cases where a flexiblesubstrate is formed in a two-layer structure of a first and a secondflexible substrate and multiple holes formed in at least one among thefirst and the second flexible substrates are formed as concave portions.

Referring to FIG. 6A, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multipleholes H disposed separately from each other. Each of the multiple holesH is formed as a concave portion having a depth less than the thicknessof the first flexible substrate SUB1. The concave portion is open towardthe back plate BP and is connected to the opening OP in the back plateBP.

Referring to FIG. 6B, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multiplefirst holes H1 disposed separately from each other. Each of the multiplefirst holes H1 is formed as a first concave portion having a depth lessthan the thickness of the first flexible substrate SUB1. The firstconcave portion is open toward the back plate BP and is connected to theopening OP in the back plate BP. The second flexible substrate SUB2 isprovided with multiple second holes H2 disposed separately from eachother. Each of the multiple second holes H2 is formed as a secondconcave portion having a depth less than the thickness of the secondflexible substrate SUB2. The second concave portion is open toward theinsulation layer IL and defines a space made airtight by an uppersurface of the insulation layer IL.

Referring to FIG. 6C, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The second flexible substrate SUB2 is provided with multipleholes H disposed separately from each other. Each of the multiple holesH is formed as a concave portion having a depth less than the thicknessof the second flexible substrate SUB2. The concave portion is opentoward the insulation layer IL and defines a space made airtight by anupper surface of the insulation layer IL.

Referring to FIG. 6D, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The second flexible substrate SUB2 is provided with multipleholes H disposed separately from each other. Each of the multiple holesH is formed as a concave portion having a depth less than the thicknessof the second flexible substrate SUB2. The concave portion is opentoward the buffer layer BUF and defines a space made airtight by a lowersurface of the buffer layer BUF.

The second embodiment of FIGS. 6A to 6D shows the examples of the caseswhere a flexible substrate is formed in a two-layer structure and holesH are formed as concave portions, and various combinations other thanthese are possible. In the second embodiment of FIGS. 6A to 6D, sincethe holes H are formed as the concave portions, only a part of theflexible substrate remains in the region of the holes H. Accordingly,shift in color coordinates is reduced and reliability is increased,simultaneously.

FIGS. 7A to 7D are cross-sectional views showing a third embodiment ofthe substrate and the buffer layer of the display device shown in FIG. 4. FIGS. 7A to 7D show embodiments of the cases where a flexiblesubstrate is formed in a two-layer structure of a first and a secondflexible substrate and all multiple holes formed in at least one amongthe first and the second flexible substrates are formed as throughholes.

Referring to FIG. 7A, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multipleholes H disposed separately from each other. Each of the multiple holesH is formed as a through hole penetrating through the first flexiblesubstrate SUB1. The through hole is open toward the back plate BP and isconnected to the opening OP in the back plate BP.

Referring to FIG. 7B, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multiplefirst holes H1 disposed separately from each other. Each of the multiplefirst holes H1 is formed as a first through hole penetrating through thefirst flexible substrate SUB1. The first through hole is open toward theback plate BP and is connected to the opening OP in the back plate BP.The second flexible substrate SUB2 is provided with multiple secondholes H2 disposed separately from each other. Each of the multiplesecond holes H2 is formed as a second through hole penetrating throughthe second flexible substrate SUB2. The second through hole is opentoward the insulation layer IL and defines a space made airtight by anupper surface of the insulation layer IL.

Referring to FIG. 7C, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The second flexible substrate SUB2 is provided with multipleholes H disposed separately from each other. Each of the multiple holesH is formed as a through hole penetrating through the second flexiblesubstrate SUB2. The through hole is open toward the buffer layer BUF andthe insulation layer IL, and defines a space made airtight by the lowersurface of the buffer layer BUF and an upper surface of the insulationlayer IL.

Referring to FIG. 7D, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multiplefirst holes H1 disposed separately from each other. The insulation layerIL is provided with multiple second holes H2 disposed separately fromeach other. The second flexible substrate SUB2 is provided with multiplethird holes H3 disposed separately from each other. The multiple firstholes H1, the multiple second holes H2, and the multiple third holes H3are through holes formed to overlap each other. Therefore, the multiplefirst holes H1, the multiple second holes HZ and the multiple thirdholes H3 are connected to the opening OP in the back plate BP.

The third embodiment of FIGS. 7A to 7D shows the examples of the caseswhere a flexible substrate is formed in a two-layer structure and holesH are formed as through holes, but various combinations other than theseare possible. In the third embodiment of FIGS. 7A to 7D, since the holesH are formed as the through holes, the flexible substrate is not presentin the region of the holes H. Accordingly, optical properties (superiortransmittance, and reduction in color coordinate shift) are superior.

FIGS. 8A to 8C are cross-sectional views showing a fourth embodiment ofthe substrate and the buffer layer of the display device shown in FIG. 4. FIGS. 8A to 8C show embodiments of the cases where a flexiblesubstrate is formed in a two-layer structure of a first and a secondflexible substrate and multiple holes formed in the first and the secondflexible substrates are a combination of concave portions and throughholes.

Referring to FIG. 8A, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multiplefirst holes H1 disposed separately from each other. Each of the multiplefirst holes H1 is formed as a through hole penetrating through the firstflexible substrate SUB1. The through hole is open toward the back plateBP and is connected to the opening OP in the back plate BP. The secondflexible substrate SUB2 is provided with multiple second holes H2disposed separately from each other. Each of the multiple second holesH2 is formed as a concave portion having a depth less than the thicknessof the second flexible substrate SUB2. The concave portion is opentoward the insulation layer IL and defines a space made airtight by anupper surface of the insulation layer IL.

Referring to FIG. 8B, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multiplefirst holes H1 disposed separately from each other. The insulation layerIL is provided with multiple second holes H2 disposed separately fromeach other. The second flexible substrate SUB2 is provided with multiplethird holes H3 disposed separately from each other. The multiple firstholes H1 and the multiple second holes H2 are through holes formed tooverlap each other. The multiple third holes H3 are concave portionseach having a depth less than the thickness of the second flexiblesubstrate SUB2, and are disposed to overlap the multiple first holes H1and the multiple second holes H2. The multiple first holes H1, themultiple second holes HZ and the multiple third holes H3 are connectedto the opening OP in the back plate BP.

Referring to FIG. 8C, the flexible substrates disposed on the back plateBP include a first flexible substrate SUB1 and a second flexiblesubstrate SUB2 that are disposed opposite each other, with an insulationlayer IL interposed therebetween. The first flexible substrate SUB1 isdisposed on an upper surface of the back plate BP, and the secondflexible substrate SUB2 is disposed under a lower surface of the bufferlayer BUF. The first flexible substrate SUB1 is provided with multiplefirst holes H1 disposed separately from each other. Each of the multiplefirst holes H1 is formed as a concave portion having a depth less thanthe thickness of the first flexible substrate SUB1. The concave portionis open toward the back plate BP and is connected to the opening OP inthe back plate BP. The second flexible substrate SUB2 is provided withmultiple second holes H2 disposed separately from each other. Each ofthe multiple second holes H2 is formed as a through hole penetratingthrough the second flexible substrate SUB2. The through hole is opentoward the insulation layer IL and defines a space made airtight by anupper surface of the insulation layer IL and a lower surface of thebuffer layer BUF.

The fourth embodiment of FIGS. 8A to 8C shows the examples of the caseswhere a flexible substrate is formed in a two-layer structure and holesare formed in a combination of concave portions and through holes, andvarious combinations other than these are possible. In the embodiment ofthe FIGS. 8A to 8C, the holes positioned in any one among the first andthe second flexible substrates overlapping each other are formed asconcave portions with the flexible substrate remaining, and the holespositioned in the other flexible substrate are formed as through holeswith no flexible substrate remaining. Accordingly, reliability isincreased and optical properties (superior transmittance, and reductionin color coordinate shift) are superior, simultaneously.

Hereinafter, with reference to FIGS. 9 and 10 , changes in colorcharacteristic depending on the thickness of the flexible substrate ofthe display device according to an embodiment of the present disclosurewill be described.

FIG. 9 is a chromaticity diagram showing changes in color characteristicin cases where the flexible substrate shown in FIG. 4 is provided withholes as in the embodiment of FIGS. 5A to 5C, and in a case where theflexible substrate is not provided with holes. FIG. 10 is a graph and atable showing changes in color coordinates in cases where the flexiblesubstrate is provided with holes as shown in FIGS. 5A to 5C, and in acase where the flexible substrate is not provided with holes.

Referring to FIG. 9 , it is found that in the case where the holes H inthe flexible substrate SUB are formed as the through holes as shown inFIG. 5C (an embodiment 1 of the present disclosure), the colorcharacteristic is positioned nearby the boundary between red, blue, andgreen, and shift in color coordinates does not occur (see symbol

in FIG. 9 ).

It is found that in the case where the holes H in the flexible substrateSUB are formed as the concave portions having the depth less than thethickness of the flexible substrate SUB as shown in FIG. 5A or 5B (anembodiment 2 of the present disclosure), the color characteristic isshifted by Δx1 in the X-axis direction and is shifted by Δy1 in theY-axis direction (see symbol

in FIG. 9 ).

In contrast, it is found that in the comparative example which is thecase where the flexible substrate SUB is not provided with holes, thecolor characteristic is shifted by Δx1 in the X-axis direction and isshifted by Δy2 in the Y-axis direction (see symbol

in FIG. 9 ).

Referring to FIG. 10 , color characteristic according to the embodimentland the embodiment 2 of the present disclosure, and colorcharacteristics according to the comparative example are different eachother. In the graph of FIG. 10 , the horizontal axis is an axisrepresenting the embodiment 1, the embodiment 2, and the comparativeexample, and the vertical axis represents the X-coordinate values (seesymbol

in FIG. 10 ) and the Y-coordinate values (see symbol

in FIG. 10 ) in FIG. 9 according to the embodiment 1, the embodiment 2,and the comparative example.

Referring to the table in FIG. 10 , it is found that in the embodiment 1of the present disclosure, there is no shift in the color coordinate ofthe X axis and the color coordinate of the Y axis, so there is no colorchange before and after the transmission of light through the flexiblesubstrate. It is found that in the embodiment 2 of the presentdisclosure, the color coordinate on the X axis is shifted by 0.059 andthe color coordinate on the Y axis is shifted by 0.065. It is found thatin the comparative example, the color coordinate on the X axis isshifted by 0.071 and the color coordinate on the Y axis is shifted by0.093.

As described above, compared to the comparative example, in the flexiblesubstrate according to the embodiments 1 and 2 of the presentdisclosure, the amount of shift in the color coordinate on the X axisand the amount of shift in the color coordinate on the Y axis aresignificantly reduced, so that the changes in color of light before andafter transmission through the flexible substrate is reduced or removed.

In the display device according to the embodiments of the presentdisclosure described above, the module, such as a camera, a sensor, andthe like, is disposed to be received in the opening of the back platepositioned in the display area, so that an increase in size of the bezelpart is prevented.

In addition, since the module is received in the opening of the backplate, the module is not exposed to outside, thereby preventingpsychological revulsion against an invasion of privacy.

In addition, the multiple holes are formed in the flexible substrate insuch a manner to correspond to the opening of the back plate, and themultiple light-transmitting areas are formed in the thin-film transistorand wire formation layer, and the opening, the multiple holes, and themultiple light-transmitting area are disposed to overlap each other, sothat the change in color of light entering the module received in theopening of the back plate is reduced and thus sensitivity to lightentering the module is increased.

The display device according to the present disclosure may be describedas follows.

According to an embodiment of the present disclosure, there is provideda display device including: a flexible substrate including an activearea and a bezel area disposed outside the active area, the active areaincluding a module area in which multiple holes are provided; a backplate disposed on one surface of the flexible substrate, and beingprovided with an opening disposed in a manner that corresponds to themodule area; a thin-film transistor and wire formation layer disposed onanother surface of the flexible substrate, and including multiplelight-transmitting areas disposed in a manner that corresponds to theopening; and a module received within the opening of the back plate,wherein the module receives light from outside through the multiplelight-transmitting areas, the multiple holes, and the opening.

In the embodiment, each of the multiple holes may be formed as a concaveportion having a depth less than a thickness of the flexible substrate,and the concave portion may be open toward the back plate and may beconnected to the opening of the back plate.

In addition, each of the multiple holes may be formed as a concaveportion having a depth less than a thickness of the flexible substrate,and the concave portion may be open toward the thin-film transistor andwire formation layer.

In addition, each of the multiple holes may be formed as a through holepenetrating through the flexible substrate, and the through hole may beopen toward the back plate (BP) and may be connected to the opening ofthe back plate.

According to an embodiment of the present disclosure, there is provideda display device including: a back plate including an active area and abezel area disposed outside the active area, the active area including amodule area in which an opening is provided; a first flexible substrate,an insulation layer, and a second flexible substrate sequentiallystacked on one surface of the back plate; a thin-film transistor andwire formation layer disposed on one surface of the second flexiblesubstrate, and including multiple light-transmitting areas disposed in amanner that corresponds to the opening; and a module received within theopening of the back plate, wherein at least one among the first flexiblesubstrate and the second flexible substrate is provided with multipleholes that correspond to the multiple light-transmitting areas,respectively, and the module receives light from outside through themultiple light-transmitting areas, the multiple holes, and the opening.

In the embodiment, the first flexible substrate may be disposed on anupper surface of the back plate, and the second flexible substrate maybe disposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may be formed in the first flexiblesubstrate, each of the multiple holes may be formed as a concave portionhaving a depth less than a thickness of the first flexible substrate,and the concave portion may be open toward the back plate and may beconnected to the opening of the back plate.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may include multiple first holesformed in the first flexible substrate, and multiple second holes formedin the second flexible substrate. Each of the multiple first holes maybe formed as a first concave portion having a depth less than athickness of the first flexible substrate, and the first concave portionmay be open toward the back plate and may be connected to the opening ofthe back plate. Each of the multiple second holes may be formed as asecond concave portion having a depth less than a thickness of thesecond flexible substrate, and the second concave portion may be opentoward the insulation layer and may define a space made airtight by anupper surface of the insulation layer.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed under a lower surface of the thin-film transistor and wireformation. The multiple holes may be formed in the second flexiblesubstrate, each of the multiple holes may be formed as a concave portionhaving a depth less than a thickness of the second flexible substrate,and the concave portion may be open toward the insulation layer and maydefine a space made airtight by an upper surface of the insulationlayer.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed under a lower surface of the thin-film transistor and wireformation. The multiple holes may be formed in the second flexiblesubstrate, each of the multiple holes may be formed as a concave portionhaving a depth less than a thickness of the second flexible substrate,and the concave portion may be open toward the thin-film transistor andwire formation layer.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may be formed in the first flexiblesubstrate, each of the multiple holes may be formed as a through holepenetrating through the first flexible substrate, and the through holemay be open toward the back plate and may be connected to the opening ofthe back plate.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may include multiple first holesformed in the first flexible substrate, and multiple second holes formedin the second flexible substrate. Each of the multiple first holes maybe formed as a first through hole penetrating through the first flexiblesubstrate, and the through hole may be open toward the back plate andmay be connected to the opening of the back plate. Each of the multiplesecond holes may be formed as a second through hole penetrating throughthe second flexible substrate, and the second through hole may be opentoward the insulation layer and may define a space made airtight by anupper surface of the insulation layer.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may be formed in the second flexiblesubstrate, each of the multiple holes may be formed as a through holepenetrating through the second flexible substrate, and the through holemay be open toward the insulation layer and may define a space madeairtight by an upper surface of the insulation layer.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may include multiple first holesformed in the first flexible substrate, multiple second holes formed inthe insulation layer, and multiple third holes formed in the secondflexible substrate. The multiple first holes, the multiple second holes,and the multiple third holes may be through holes formed to overlap eachother, and may be connected to the opening of the back plate.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may include multiple first holesformed in the first flexible substrate, and multiple second holes formedin the second flexible substrate. Each of the multiple first holes maybe formed as a through hole penetrating through the first flexiblesubstrate, and the through hole may be open toward the back plate andmay be connected to the opening of the back plate. Each of the multiplesecond holes may be formed as a concave portion having a depth less thana thickness of the second flexible substrate, and the concave portionmay be open toward the insulation layer and may define a space madeairtight by an upper surface of the insulation layer.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may include multiple first holesformed in the first flexible substrate, multiple second holes formed inthe insulation layer, and multiple third holes formed in the secondflexible substrate. The multiple first holes and the multiple secondholes are through holes formed to overlap each other, and the multiplethird holes may be concave portions each having a depth less than athickness of the second flexible substrate and may be disposed tooverlap the multiple first holes and the multiple second holes. Themultiple first holes, the multiple second holes, and the multiple thirdholes may be connected to the opening of the back plate.

In addition, the first flexible substrate may be disposed on an uppersurface of the back plate, and the second flexible substrate may bedisposed on a lower surface of the thin-film transistor and wireformation layer. The multiple holes may include multiple first holesformed in the first flexible substrate, and multiple second holes formedin the second flexible substrate. Each of the multiple first holes maybe formed as a concave portion having a depth less than a thickness ofthe first flexible substrate, and the concave portion may be open towardthe back plate and may be connected to the opening of the back plate.Each of the multiple second may be formed as a through hole penetratingthrough the second flexible substrate, and the through hole may be opentoward the insulation layer.

In addition, according to the embodiments of the present disclosure, thedisplay device may further include: at least one buffer layer disposedbetween one surface of the thin-film transistor and wire formation layerand the flexible substrate or the second flexible substrate; and alight-emitting element layer disposed on another surface of thethin-film transistor and wire formation layer, and including multiplepixels and a bank dividing the multiple pixels, wherein the bank may bedisposed to overlap the multiple light-transmitting areas, the multipleholes, and the opening.

Although the embodiments of the present disclosure have been describedin detail with reference to the accompanying drawings, the presentdisclosure is not limited thereto and may be embodied in many differentforms without departing from the technical idea of the presentdisclosure. Therefore, the embodiments of the present disclosure areprovided for illustrative purposes only but not intended to limit thetechnical idea of the present disclosure. The scope of the technicalidea of the present disclosure is not limited thereto. Therefore, itshould be understood that the embodiments described above areillustrative in all aspects and not restrictive. The protective scope ofthe present disclosure should be construed by the following claims, andall the technical ideas in the equivalent scope thereof should beconstrued as falling within the scope of the present disclosure.

What is claimed is:
 1. A display device comprising: a back plateincluding an opening; a module disposed in the opening of the backplate; a flexible substrate disposed on the back plate, the flexiblesubstrate overlapping the opening; a buffer layer disposed on themodule, the buffer layer including a plurality of different inorganicmaterials; a plurality of sub-pixels disposed on the module; a bankdisposed on the module and disposed between the plurality of sub-pixels;an encapsulation layer disposed on the plurality of sub-pixels and thebank; a thin-film transistor disposed on the module, the thin-filmtransistor configured to supply a signal to at least one of theplurality of sub-pixels and the thin-film transistor including an oxidesemiconductor layer; a wire disposed on a layer on which the thin-filmtransistor is disposed on the module, the wire supplying the signal tothe at least one of the plurality of sub-pixels; multiplelight-transmitting areas disposed between the plurality of sub-pixelsand disposed on a layer on which the thin-film transistor and the wireare disposed.
 2. The display device of claim 1, wherein one of theplurality of different inorganic materials includes a silicon oxidefilm.
 3. The display device of claim 1, wherein the module includes atleast one of a camera or a sensor.
 4. The display device of claim 1,wherein the thin-film transistor is not disposed in the multiplelight-transmitting areas.
 5. The display device of claim 1, wherein eachof the plurality of sub-pixels includes an anode electrode, a cathodeelectrode, and an organic emission layer.
 6. The display device of claim1, wherein the encapsulation layer comprises a multi-layer structure inwhich inorganic and organic layers are alternately disposed.
 7. Thedisplay device of claim 1, wherein the flexible substrate includesmultiple holes.
 8. The display device of claim 7, wherein the multipleholes overlap the multiple light-transmitting areas.
 9. The displaydevice of claim 7, further comprising: a polarizing film disposed overthe opening.
 10. The display device of claim 9, wherein the modulereceives light from outside through the polarizing film, theencapsulation layer, the bank, the multiple light-transmitting areas,the multiple holes, and the opening.